|
|
MANUFACTURING
CAPABILITIES |
| |
2002 CAPABILITY |
2003
CAPABILITY |
| LAYER COUNT |
2~26 |
28 AND ABOVE |
| LINE WIDTHS |
MIN
0.004" |
MIN
0.003" |
| SPACING |
MIN
0.004" |
MIN
0.004" |
| BOARD THICKNESS |
MAX
2.00" |
MAX 2.500 |
| ASPECT RATIO |
10:1 |
12:1 |
| BASE MATERIAL |
FR-4, HIGH TG FR-4, POLYMIDE, ROGERS, TEFLON |
GETEK, NELCO, ARLON, CYANATE ESTER |
| IMPENDENCE CTRL |
+-10% |
+-8% |
| SMT PITCH |
MIN
0.0065" |
MIN
0.006" |
| VIA PAD SIZE |
MIN
0.016" |
0.014" |
| BLIND/BURIED VIA |
SEQUENTIAL LAMINATION |
HDI (LASER) |
| PTH SIZE |
MIN 0.008 (MACHINE) |
MIN 0.004 (LASER) |
| DRILL POSITION ACCURACY |
+-
0.003" |
+-0.0016" |
| PLUGGED HOLE SIZE |
MAX
0.022" |
MAX
0.028" |
| CORE THICKNESS |
MIN
0.004" |
MIN
0.003" |
| THICK FOIL |
4 OZ (INT AND EXT) |
6 OZ (INT AND EXT) |
| BOARD SIZE |
MAX
22.25" X 22.8" |
MAX
22.25" X 22.8" |
| WARP AND TWIST |
<0.7% |
<0.5% |
| EXTERNAL HEATSINKS |
ALUMINUM, COPPER |
STEEL |
| SOLDER MASK |
TAIYO PSR4000, ETHONE |
TAIYO PSR4000, ETHONE |
| S/M THICKNESS |
MIN
0.0004" |
MIN
0.0005" |
| S/M CLEARANCE |
0.002" |
0.002" |
| SURFACE FINISH |
OPS (ENTEK 106 A), HASL, IMMERSION GOLD, DEEP TANK HARD AND SOFT GOLD,
IMMERSION TIN, CARBON INK |
|
