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Technology Road Map
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Rigid/Flex Current |
Rigid Past |
| Layer Count |
28 and Above |
2-26 |
| Line Widths |
Min 0.003" |
Min 0.004" |
| Spacing |
Min 0.004" |
Mine 0.004" |
| Board Thickness |
Max 2.500 |
Max 2.00" |
| Aspect Ratio |
12:1 |
10:1 |
| Base Material |
Getek, Nelco, Arlon, Cyanate, Ester |
FR-4, High TG FR-4, Polymide, Rogers, Teflon |
| Impendence Ctrl |
+ 8% |
+10% |
| SMT Pitch |
Min 0.006" |
Min 0.0065" |
| Via Pad Size |
0.014" |
Min 0.016" |
| Blind/Buried Via |
HDI (Laser) |
Sequential Lamination |
| Pth Size |
Min 0.004 (Laser) |
Min 0.008 (Machine) |
| Drill Position Accuracy |
+ 0.0016" |
+0.003 |
| Plugged Hole Size |
Max 0.028" |
Max 0.022" |
| Core Thickness |
Min 0.003" |
Min 0.004" |
| Thick Foil |
6 oz (Interior and Exterior) |
4 oz (Interior and Exterior) |
| Board Size |
Max 22.25" x 22.8" |
Max 22.25" x 22.8" |
| Warp and Twist |
<0.5% |
<0.7% |
| External Heatsinks |
Steel |
Aluminum, Copper |
| Solder Mask |
Taiyo PSR40000, Ethone |
Taiyo PSR4000, Ethone |
| S/M Thickness |
Min 0.0005" |
Min 0.0004" |
| S/M Clearance |
0.002" |
0.002" |
| Surface Finish |
OPS (Entek 106A), HASL, Immersion Gold, Deep Tank Hard and Soft Gold, Immersion Tin, Carbon Ink |
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