Technology Road Map
| Rigid/Flex Current | Rigid Past | |
|---|---|---|
| Layer Count | 28 and Above | 2-26 |
| Line Widths | Min 0.003" | Min 0.004" |
| Spacing | Min 0.004" | Mine 0.004" |
| Board Thickness | Max 2.500 | Max 2.00" |
| Aspect Ratio | 12:1 | 10:1 |
| Base Material | Getek, Nelco, Arlon, Cyanate, Ester | FR-4, High TG FR-4, Polymide, Rogers, Teflon |
| Impendence Ctrl | + 8% | +10% |
| SMT Pitch | Min 0.006" | Min 0.0065" |
| Via Pad Size | 0.014" | Min 0.016" |
| Blind/Buried Via | HDI (Laser) | Sequential Lamination |
| Pth Size | Min 0.004 (Laser) | Min 0.008 (Machine) |
| Drill Position Accuracy | + 0.0016" | +0.003 |
| Plugged Hole Size | Max 0.028" | Max 0.022" |
| Core Thickness | Min 0.003" | Min 0.004" |
| Thick Foil | 6 oz (Interior and Exterior) | 4 oz (Interior and Exterior) |
| Board Size | Max 22.25" x 22.8" | Max 22.25" x 22.8" |
| Warp and Twist | <0.5% | <0.7% |
| External Heatsinks | Steel | Aluminum, Copper |
| Solder Mask | Taiyo PSR40000, Ethone | Taiyo PSR4000, Ethone |
| S/M Thickness | Min 0.0005" | Min 0.0004" |
| S/M Clearance | 0.002" | 0.002" |
| Surface Finish | OPS (Entek 106A), HASL, Immersion Gold, Deep Tank Hard and Soft Gold, Immersion Tin, Carbon Ink |
